TAIFLEX offers superior flexible, light and thin FPC materials such as FCCL, Coverlay, Bonding Sheet, Stiffener and Composited film. We also aggressively move toward the High-density, Fine-pitch, Low-loss and high-speed applications, including Anti-migration Bonding sheet and Coverlay, Low-loss Bonding sheet, Coverlay and also MPI, LCP, Fluoro FCCL. By providing the market with advanced and diverse solutions, TAIFLEX gained global customers trust and support continually.
Excellent anti-migration capability, superior dimensional stability and high tensile strength
Halogen/Bismuth-free, UL and RoHS certified
Battery, industrial control, automotive applications, etc.; Comprehensive product specifications and full thickness range
| Cu 1/3~2oz | PI Film 0.5~2mil |
| Adhesive | Adhesive |
| PI Film 0.5~2mil | Cu 1/3~2oz |
| Adhesive | |
| Cu 1/3~2oz |
Thin, light, superior flexural endurance and high dimensional stability
High glass transition temperature (Tg) as well as superior weather and chemical resistance, with UL and RoHS certification
Antenna, button and battery for mobile phones; Comprehensive product specifications and full thickness range
| Cu 1/4~2oz | PI 0.5~2mil |
| TPI 0.5~4mil | Cu 1/4~2oz |
| Cu 1/4~2oz |
For FCCL of FPC (Low-loss) – three series: MPI, LCP and Fluoro Polymer
Low Df
Antenna, USB-C and transmission line
| Cu 1/3~1/2oz | Dielectric layer 0.5~4mil |
| Dielectric layer 0.5~4mil | Cu 1/3~1/2oz |
| Cu 1/3~1/2oz |
High voltage resistant for high reliability automotive applications, while being thin, light, and highly flexible.
Automotive battery management system (BMS), Combined Charging System (CCS), (quick) charger, automotive lighting, seat/steering wheel heating system, etc.
| Cu 1/3~2oz | PI Flim 1mil~2mil |
| Adhesive | Adhesive |
| PI Flim 1mil~2mil | Cu 1/3~2oz |
| Adhesive | |
| Cu 1/3~2oz |
