TAIFLEX offers superior flexible, light and thin FPC materials such as FCCL, Coverlay, Bonding Sheet, Stiffener and Composited film. We also aggressively move toward the High-density, Fine-pitch, Low-loss and high-speed applications, including Anti-migration Bonding sheet and Coverlay, Low-loss Bonding sheet, Coverlay and also MPI, LCP, Fluoro FCCL. By providing the market with advanced and diverse solutions, TAIFLEX gained global customers trust and support continually.
To protect FPC circuits, available in three colors: black, amber and white
Halogen/Antimony/Bismuth-free
Used for FPC circuit protection
PI 0.3~2mil (Black / Amber / White) |
Adhesive 10~50μm |
Release Paper |
To protect the circuits of various FPC
Outstanding heat resistance during lamination and operability
Rigid-flex board and multilayer FPC
PI Film 0.3~1.0mil | |
Adhesive 15~25μm | |
Release Paper |
To protect the circuits of various multilayer FPC and Rigid-flex board
Outstanding anti-migration capability
Camera、Display、Battery
PI 0.2~2.0mil (Amber & Black) | |
Adhesive 10~50μm | |
Release Paper |
To protect FPC circuits
Low Df
Antenna, USB-C and transmission line
PI Film 0.5mil | |
Low Loss AD 15/20/25μm | |
Release Paper |